Clean Oxygen-Free Oven （G-10S）
Category：Tunnel Oven Production Line
Introduction
The Clean Oxygen-Free Oven G-10S is designed for high-precision baking processes requiring a clean and low-oxygen atmosphere. It adopts hot air circulation heating and a dual-door single-chamber structure to provide stable temperature control and uniform heat distribution.
The oven is widely used in PCB, TP, LCD, electronic components, and silicone industries for material aging, silver paste curing, ink drying, and other thermal processing applications. Nitrogen filling can reduce oxygen concentration to 100 ppm, helping prevent oxidation during heat treatment. Customized solutions are available according to customer process requirements.
Applications
The Clean Oxygen-Free Oven G-10S is suitable for:
PCB baking and thermal curing
TP and LCD module processing
Electronic component aging treatment
Silver paste curing
Conductive adhesive curing
Ink drying processes
Silicone material heat treatment
Precision parts requiring low-oxygen baking environments
Technical Parameters
| Parameter | Specification |
|---|---|
| Model | MO-10S |
| Heating Method | Hot air circulation heating |
| Chamber Structure | Double-door single-chamber design |
| Control Box Position | Left side of equipment |
| Internal Material | SUS304 stainless steel |
| Air Duct Material | SUS304 stainless steel |
| External Material | SS41 steel plate with high-temperature coating |
| Insulation Material | High-density insulation cotton |
| Insulation Thickness | 150 mm |
| Temperature Setting Range | Room temperature – 250℃ |
| Temperature Uniformity | ≤±1℃ (6-point empty chamber test) |
| Heating Time | Approx. 25 min from room temperature to 150℃ |
| Airflow Direction | Double-side horizontal air circulation |
| Timer Range | 0–9999 minutes |
| Oxygen Concentration | ≤100 ppm (with nitrogen filling) |
| Nitrogen Inlet Pipe Diameter | Ø12 mm |
| Nitrogen Control | Adjustable nitrogen flow |
| Gas Source | Adjustable 6 inch |
| Exhaust Port | Adjustable 6 inch |
| Cleanliness Level | Class 100 |
| Inner Chamber Size | W1000 × D700 × H1500 mm |
| Power Supply | AC380V, 3 Phase, 50Hz |
| Power Consumption | 18 kW |
| Weight | Approx. 260 kg |
Features
Low Oxygen Baking Environment
Supports adjustable nitrogen filling to reduce oxygen concentration to 100 ppm and prevent material oxidation.
Uniform Hot Air Circulation
Double-side horizontal airflow design ensures balanced air distribution and stable temperature performance.
Large Capacity Single Chamber
The W1000 × D700 × H1500 mm chamber provides sufficient working space for batch processing.
Cleanroom Compatible Structure
SUS304 stainless steel chamber and airflow channels help reduce contamination and particle generation.
Energy-Efficient Insulation Design
Six-side insulation structure with 150 mm insulation material reduces heat loss and improves energy efficiency.
Precise Temperature Control
Digital PID temperature controller with SSR output provides accurate and stable temperature regulation.
Reliable Air Circulation System
High-temperature long-shaft motor ensures continuous and stable airflow operation.
Convenient Operation Design
Double doors with heat-resistant silicone sealing provide easy loading and effective chamber sealing.
Comprehensive Safety Protection
Equipped with over-temperature protection, motor overload protection, heater overload protection, circuit protection, and non-fuse breaker.
Customizable Configuration
Chamber size, nitrogen control system, airflow structure, and process parameters can be customized according to production requirements.
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