Clean Oxygen-Free Oven

The Clean Oxygen-Free Oven is designed for precision baking processes requiring a clean and low-oxygen environment. The equipment adopts hot air circulation, nitrogen inlet/exha...

Introduction

The Clean Oxygen-Free Oven is designed for precision baking processes requiring a clean and low-oxygen environment. The equipment adopts hot air circulation, nitrogen inlet/exhaust control, and HEPA filtration technology to provide a stable and controlled thermal processing environment.

The oven is manufactured according to drying oven technical requirements including GB 2423.2-1989 and GB/T 11158-1988. It is widely used in LCD, CMOS IC, electronic components, medical laboratories, and other industries requiring strict control of temperature, cleanliness, and oxidation.

Applications

The Clean Oxygen-Free Oven is suitable for:

LCD and liquid crystal display component processing

CMOS IC and semiconductor component baking

Electronic component aging and thermal treatment

Medical laboratory sample drying

Precision material heat treatment

Oxygen-sensitive material curing and drying

Cleanroom production processes requiring low particle levels

Technical Parameters

Parameter Specification
Equipment Type Clean Oxygen-Free Oven
Working Chamber Size W500 × D650 × H500 mm / W600 × D700 × H600 mm / W700 × D900 × H700 mm
Cleanliness Level Class 100 (FED-STD-209E compliant)
Particle Control 0.3 μm particles <300 pcs, 0.5 μm particles <100 pcs
Temperature Range +50℃ to +250℃
Maximum Temperature 360℃
Temperature Uniformity ±2℃ (empty chamber test)
Temperature Accuracy ±1℃ (empty chamber test)
Heating Method Clean oxidation-free electric heating system
Airflow Direction Horizontal airflow from left to right
Filtration System Imported HEPA filter
Temperature Controller PID automatic tuning temperature controller
Temperature Control Output SSR solid-state relay power control
Temperature Sensor Armored K-type thermocouple
Temperature Monitoring 6-channel temperature recorder
Control System Touchscreen operation
Inner Chamber Material SUS304 stainless steel
External Material SS441 steel plate with high-temperature coating
Insulation Material 128K high-density insulation board
Gas Control Nitrogen inlet and exhaust system
Safety Protection Emergency stop, over-temperature protection, power failure alarm, phase protection, overload protection, short circuit protection, leakage protection, electromagnetic door interlock

Features

Clean Oxygen-Free Processing Environment

Nitrogen inlet and exhaust control reduces oxygen concentration and helps prevent oxidation during high-temperature baking.

Class 100 Cleanliness Design

Equipped with HEPA filtration and optimized airflow structure to reduce airborne particles.

High Temperature Stability

Supports operating temperatures up to 250℃ with a maximum temperature of 360℃ for special processes.

Precision Temperature Control

PID control with SSR output provides accurate temperature regulation and stable operation.

Uniform Airflow System

Horizontal airflow design ensures balanced air distribution and improved temperature uniformity.

SUS304 Stainless Steel Chamber

Fully welded stainless steel inner chamber reduces contamination and prevents particle generation.

Energy-Saving Insulation Structure

High-density 128K insulation material minimizes heat loss and improves energy efficiency.

Advanced Temperature Monitoring

Six-channel temperature recorder provides real-time monitoring and process documentation.

Intelligent Control System

Touchscreen operation simplifies parameter setting and equipment management.

Complete Safety Protection

Multiple protection functions ensure safe and reliable operation during production.

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